Science Research Management ›› 2025, Vol. 46 ›› Issue (11): 173-182.DOI: 10.19571/j.cnki.1000-2995.2025.11.017
• 5DDD299A-561 • Previous Articles Next Articles
Lin Chun, Wen Xiaoou, Sun Yingjie
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Abstract: Confronted with the complex and severe situations of development, maintaining the economic feature of ‘strong resilience’ is an important guarantee for realizing Chinese modernization. Based on the panel data of 285 cities from 2008 to 2021, this paper adopted intellectual protection as an entry point, and used the staggered difference-in-differences model to explore its impact on urban economic resilience. It is found that the construction of intellectual property demonstration cities has an effect of significantly improving urban economic resilience, with the level of public services and innovation capacity being important channels of interaction between the two, and premiumization of innovation preferences contributing to the effect. The heterogeneity analyses showed that the policy′s promotional effect is more pronounced in the western region, in cities with lower investment in education, lower attractiveness and lower domestic investment. In addition, the economic effects analyses found that the construction of intellectual property demonstration cities could further unleash the consumption dynamics of the region after enhancing urban economic resilience. The conclusions of this paper will explore the boundaries of the impact of intellectual property protection while opening up new ideas for strengthening economic resilience, thus providing references for the construction of soft environment in the new stage of economic development.
Key words: intellectual property demonstration city, urban economic resilience, public service level, innovation capacity, innovation preference
Lin Chun, Wen Xiaoou, Sun Yingjie. Research on the impact of intellectual property demonstration city construction on urban economic resilience[J]. Science Research Management, 2025, 46(11): 173-182.
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URL: https://www.kygl.net.cn/EN/10.19571/j.cnki.1000-2995.2025.11.017
https://www.kygl.net.cn/EN/Y2025/V46/I11/173