如何证明并测量专利丛林，一直是一个难题。专利丛林是指众多且重叠的专利，可能形成稠密的网络，寻求将新技术商业化的企业必须获得多个专利权人的许可。由于我国专利文献不要求说明专利引证关系，所有国外的测量方法在我国无法适用。本文以1997-2010年我国LED封装技术专利为样本，综合运用帕累托位序规模法、比例法和首位度等方法进行测量，研究表明我国LED封装技术领域专利呈现分散趋势。
Abstract
It always remains difficult howto certify and measure the patent thicket, which means many and overlapping patents in a dense network, and the enterprises which seek new technology for commercialization must be licensed by more than one patent owners. As the patent documents filed to the Patent Office of P.R.Care not required to introduce the cited relationshipamong patents,all the foreign measurement methods which are extensively applied to measuring the patent thicket are not suitable for our country. This paper takes LED packaging technology patents from 1997 to 2010 in China as an example, uses comprehensively the methods ofPareto law, the proportion method and prime lawmeasure, and the research shows that the LED packaging technology patents have illustrated a fragmentation tendency in China.
关键词
专利丛林 /
LED封装技术专利 /
专利分散
Key words
patent thicket /
LED packaging technology patents /
patent fragmentation
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基金
教育部人文社科规划基金资助项目"LED产业专利分散度测量及专利战略选择研究"(批准号：11YJA630188)，起止时间(2011.9-2014.4);华中科技大学自主创新研究基金项目"专利商业模式创新对高校专利管理影响及对策研究"(批准号：2012TS066)，起止时间(2012.6-2013.12)。
